87832-1420 Mosfet Power Module Electronics ICs Chip Integarted Circuts
A part of stock list
| CAP 0603 150PF 50V CL10C151JB8NNNC |
800000 |
SAMSUNG |
AC7502D |
| CAP 0603 180PF 50V CL10B181KB8NNNC |
800000 |
SAMSUNG |
AA20SEE |
| RES 0805 5K9 1% RC0805FR-075K9L |
500000 |
YAGEO |
1606 |
| RES 0805 20K5 1% RC0805FR-0720K5 |
500000 |
YAGEO |
1606 |
| C.I LNK623PG |
10000 |
POWER |
1407 |
| C.I STM32F030K6T6 |
10000 |
ST |
1549 |
| DIODO ES1J-E3/61T |
180000 |
VISHAY |
1642/EJ |
| CAP 0603 10PF 50V NPO 5% CL10C100JB8NNNC |
400000 |
SAMSUNG |
CCBET1P |
| DIODO 1N5822 AMMO |
1000000 |
MIC |
307260623445 |
| TRANS BF422 |
2000 |
TOS |
5F |
| DIODO 1.5KE7.5CA-E3/4 |
5000 |
VISHAY |
16+ |
| CONECTOR S3B-PH-SM4-TB(LF)(SN) |
3200 |
JST |
15+ |
CONEC.
BM06B-SRSS-TB(LF)(SN) |
3000 |
JST |
15+ |
| CONECTOR S4B-PH-SM4-TB(LF)(SN) |
9200 |
JST |
2015.11 |
| C.I A2982SLWTR-T |
3100 |
ALLEGRO |
1642 |
| OPTOACOPLADOR CNY74-4H |
1000 |
VISHAY |
V413H68 |
| DIODO S1G-E3/61T |
18000 |
VISHAY |
1632/SG |
| CI ADS7866IDBVR |
2500 |
TI |
A66Y |
| CI MSP430F417IPMR |
2500 |
TI |
69A2P1W |
| C.I MC14584BDR2G |
3000 |
ON |
PAC928 |
| C.I PIC12F508-I/SN |
1000 |
MICROCHIP |
1624KC6 |
| C.I LM1117IMPX-3.3/NOPB |
2000 |
TI |
4ARD/N05B |
Feature
Agency Certification CSA LR19980 UL E29179
General Product Family PCB Headers Series 87832
Application Wire-to-Board Comments Contact Molex for application in automotive industry
MolexKits Yes Overview milligrid Product Name Milli-Grid™
Physical Breakaway No Circuits (Loaded) 14 Circuits (maximum) 14 Color
- Resin Black First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant
No Guide to Mating Part No Keying to Mating Part Yes Lock to Mating Part Yes
Material - Metal Phosphor Bronze Material - Plating Mating Gold Material
- Plating Termination Tin Material - Resin Nylon Number of Rows 2 Orientation Vertical PCB Locator Yes PCB Retention None Packaging Type Tube Pitch - Mating Interface (in) 0.079 In Pitch - Mating Interface (mm) 2.00 mm Pitch - Term. Interface (in) 0.079 In Pitch - Term. Interface (mm) 2.00 mm Plating min: Mating (µin) 15 Plating min: Mating (µm) 0.38 Plating min: Termination (µin) 75 Plating min: Termination (µm) 1.88
Temperature Range - Operating -55°C to +105°C
Termination Interface: Style Surface Mount Electrical Current
- Maximum per Contact 2A Voltage - Maximum 125V
Solder Process Data Duration at Max.
Process Temperature (seconds) 10 Lead-free
Process Capability Reflow Capable (SMT only) Max. Cycles at Max.
Process Temperature 1 Process Temperature max. C 260
Material Info Reference - Drawing Numbers Product Specification
PS-87831-027 Sales Drawing SD-87832-006
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87832-1420 Mosfet Power Module Electronics ICs Chip Integarted Circuts Images
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